doc. no : qw0905- rev. : date : - 2005 07 - jan a la10b/12g data sheet ligitek electronics co.,ltd. property of ligitek only led array la10b/12g
note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lg7120 package dimensions la10b/12g part no. page 1/4 ligitek electronics co.,ltd. property of ligitek only - + 73.0 ?? 0.5 ytp 7.0 4.8 1.1 1.0 g gg g gg gg 8.5 1.0min 12.5min 6.0 4.0 g ggg 1.5 max ?? 0.5 typ 1.0 12.5min 2.3typ 1.0min 2.9 8.0 3.5 5.0 2.3typ 6.0x11=66.0
-40 ~ +100 tstg storage temperature note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. gap la10b/12g 1.8 1.7 30 2.6 1.2 green diffused 565 green 118 material soldering temperature typical electrical & optical characteristics (ta=25 j ) part no typ. luminous intensity @10ma(mcd) forward voltage @ ma(v) spectral halfwidth ??f nm peak wave length f pnm emitted lens color min. max. min. 20 viewing angle 2 c 1/2 (deg) tsol max 260 j for 5 sec max (2mm from body) j la10b/12g page 2/4 part no. reverse current @5v operating temperature peak forward current duty 1/10@10khz absolute maximum ratings at ta=25 j forward current power dissipation parameter 30 ma i f t opr ir -40 ~ +85 10 120 100 pd i fp j g a ma mw g symbol ratings unit ligitek electronics co.,ltd. property of ligitek only
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. la10b/12g fig.6 directive radiation 3/4
the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec high temperature high humidity test thermal shock test solder resistance test 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 4/4 page the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) high temperature storage test low temperature storage test 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) reliability test: test item test condition description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard ligitek electronics co.,ltd. property of ligitek only part no. la10b/12g
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